GB/T 7581-1987
Active
GB/T 42706.5-2023
Active
National standards
GB/T 42706.5-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 5:Die and wafer devices
GB/T 42706.5-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 5:Die and wafer devices
Basic Information
Standard Code:
GB/T 42706.5-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor discrete devices
ICS Name:
Semiconductor discrete devices
Publish Date:
2023-05-23
Implement Date:
2023-09-01
Pages:
17 pages
Scope
This document specifies the storage conditions and rules for individual chips, partial wafers, or entire wafers, as well as chips with metal structures (introduction of metal layers, bump bonding, etc.), and provides operational guidance for general and specialized packaging products containing chips or wafers.
This document is applicable to the long-term storage of chips and wafers expected to be stored for more than 12 months.
Development Information
Same series standard
Referenced Standards
IEC 62435-2
Adopt standards
IEC 62435-5:2017
Related Standards
GB/T 4586-1994
Active
GB/T 4586-1994 Semiconductor devices Discrete devices—Part 8:Field-effect transistors
GB/T 4587-1994
Replaced
GB/T 4587-1994 Semiconductor discrete devices and integrated circuits—Part 7:Bipolar transistors
GB/T 4937-1995
Replaced
GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 9313-1995
Active
GB/T 9313-1995 General specifications for CRT display device of computer
GB/T 8446.1-2004
Replaced