GB/T 43136-2023 Active National standards

GB/T 43136-2023 Superabrasive products—Precision dicing and cutting wheels for semiconductor chips

GB/T 43136-2023 Superabrasive products—Precision dicing and cutting wheels for semiconductor chips

Publish Date: 2023-09-07 Implement Date: 2024-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 43136-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Abrasives and abrasive tools
ICS Name: Abrasives and grinding tools
Publish Date: 2023-09-07
Implement Date: 2024-04-01
Pages: 13 pages

Scope

This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of diamond grinding wheels used for precision scribing of semiconductor chips. This document is applicable to electroplated bonding agents, resin bonding agents, and metal bonding agents used for precision scribing of semiconductor wafers and precision cutting of packaged chips.

Development Information

Word Count: 27 Thousand words Pages: 13 pages

Referenced Standards

Related Standards

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