GB/T 20422-2018 Active National standards

GB/T 20422-2018 Lead-free solders

GB/T 20422-2018 Lead-free solders

Publish Date: 2018-05-14 Implement Date: 2018-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 20422-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Welding and cutting
ICS Name: \nBrazing and low-temperature welding
Publish Date: 2018-05-14
Implement Date: 2018-12-01
Pages: 10 pages

Scope

This standard specifies the models, technical requirements, test methods, inspection rules, and packaging, marking, and quality certification of lead-free solder products. This standard is applicable to lead-free solder used for connecting wires and components in electrical and electronic equipment, communication devices, and other applications.

Development Information

Word Count: 19 Thousand words Pages: 10 pages

Replace the following standards

Referenced Standards

GB/T 1480-1995 Determination of particle size for metallic powders—Dry sieving GB/T 1480-2012 Metallic powders—Determination of particle size by dry sieving GB/T 8170-1987 Rules for rounding off of numberical values GB/T 8170-2008 Rules of rounding off for numerical values & expression and judgement of limiting values GB/T 33148-2016 Soldering and brazing terms YS/T 746.1-2010 Methods for chemical analysis of lead-free tin-based solders—Part 1:Determination of tin content—Pyrogallic acid demasking-lead nitrate titrimetric method YS/T 746.2-2010 Methods for chemical analysis of tin-based lead-free solders—Part 2:Determination of silver content—Flame atomic absorption spectrometric method and potassium thiosulfate titrimetric method YS/T 746.3-2010 Methods for chemical analysis of tin-based lead-free solders—Part 3:Determination of copper content—Flame atomic absorption spectrometric method and sodium thiosulfate titrimetric method YS/T 746.4-2010 Methods for chemical analysis of lead-free tin-based solders—Part 4:Determination of lead content—Flame atomic absorption spectrometric method YS/T 746.5-2010 Methods for chemical analysis of lead-free tin-based solders—Part 5 Determination of bismuth content—Flame atomic absorption spectrometric method and EDTA titrimetric method YS/T 746.6-2010 Methods for chemical analysis of lead-free tin-based solders—Part 6:Determination of antimony content—Flame atomic absorption spectrometric method YS/T 746.7-2010 Methods for chemical analysis of lead-free tin-based solders—Part 7:Determination of iron content—Flame atomic absorption spectrometric method YS/T 746.8-2010 Methods for chemical analysis of lead-free tin-based slders—Part 8:Determination of arsenic content—Molybdenum antimony arsenate blue spectrometric method YS/T 746.9-2010 Methods for chemical analysis of lead-free tin-based solders—Part 9:Determination of zinc content—Flame atomic absorption spectrometric method and Na2EDTA titrimetric method YS/T 746.10-2010 Methods for chemical analysis of lead-free tin-based solders—Part 10:Determination of aluminum content—Electrothermal atomic absorption spectrometric method YS/T 746.11-2010 Methods for chemical analysis of lead-free tin-based solders—Part 11:Determination of Cadmium content—Flame atomic absorption spectrometric method YS/T 746.12-2010 Methods for chemical analysis of lead-free tin-based solders—Part 12:Determination of Indium content—Na2EDTA titrimetric method YS/T 746.13-2010 Methods for chemical analysis of tin-based lead-free solders—Part 13:Determination of nickel content—Flame atomic absorption spectrometric method YS/T 746.14-2010 Methods for chemical analysis of lead-free tin-based solders—Part14:Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdenum heteropoly acid spectrophotometry YS/T 746.15-2010 Methods for chemical analysis of lead-free tin-based solders—Part 15:Determination of Germanium content—Salicylfluorone-sim polyethylene glycol phenyl ether spectrophotometry YS/T 746.16-2010 Methods for chemical analysis of lead-free tin-based solders—Part 16:Determination of total rare earth content—Arserazo Ⅲ spectrophotometry YS/T 746.17-2018 Method for Chemical Analysis of Lead-free Sn-based solder - Part 17: Determination of Ag, Cu, Pb, Bi, Sb, Fe, As, Zn, Al, Cd, Ni, and In - Electro-magnetic induction coupled plasma atomic emission spectroscopy GB/T 1480-2025 Metallic powders—Determination of particle size by dry sieving

Adopt standards

ISO 9453:2014

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