T/SZSA 034-2025 Active Group standards

T/SZSA 034-2025 High-speed ESD & TVS protection chip test specifications

Publish Date: 2025-12-22 Implement Date: 2026-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SZSA 034-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Medical electronic instruments and equipment

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2025-12-22

Implement Date: 2026-01-01

Scope

This standard specifies the TVS selection parameters (including operating voltage, polarity, and capacitance) for mainstream high-speed interfaces such as HDMI and USB, clarifies the selection criteria for TVS based on different interface types, and prescribes the testing process and equipment calibration norms (such as TRL calibration) for key indicators like high-frequency capacitance, S-parameters, and transient overvoltage. This standard applies to the selection and design of TVS devices for mainstream high-speed interfaces (e.g., HDMI and USB), as well as the testing and calibration of critical indicators like high-frequency capacitance, S-parameters, and transient overvoltage. It can help reduce the difficulty of interface design for application developers and ensure the comparability of test data across different testing institutions. With the rapid development of information technology, high-speed interfaces such as HDMI, USB, Ethernet, and PCIe have been widely applied in consumer electronics, automotive electronics, industrial control, and other fields, with data transmission rates surging from several Gbps to tens of Gbps. While these high-speed interfaces enhance the efficiency of information exchange, their sensitivity to electrostatic discharge (ESD) and surge has significantly increased. TVS protection chips, as core components for resisting transient interference, directly affect the reliability and signal integrity of electronic devices. Existing standards primarily focus on the basic indicators of general TVS devices, with insufficient coverage of selection criteria and high-frequency testing methods (e.g., vector network analyzer calibration and eye diagram testing) in high-speed scenarios, resulting in high technical integration costs and poor product compatibility across the industry chain (chip manufacturers, equipment manufacturers, and testing institutions). To address these issues, this standard unifies the TVS selection parameters (opera