GB/T 14264-1993
Replaced
T/TMAC 232-2025
Active
Group standards
T/TMAC 232-2025 Poly-crystal diamond thermal-sweeping film
T/TMAC 232-2025 Poly-crystal diamond thermal-sweeping film
Price:
$ 33.00
Basic Information
Standard Code:
T/TMAC 232-2025
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated Components of Semiconductor Devices
Publish Date:
2025-09-10
Implement Date:
2025-09-10
Scope
This document is applicable to the production, design, and testing of polycrystalline diamond heat sinks. This document specifies the technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for polycrystalline diamond heat sinks.
Development Information
Related Standards
GB/T 14844-1993
Replaced
GB/T 14844-1993 Designations of semiconductor materials
GB/T 17573-1998
Active
GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General
GB/T 12560-1999
Active
GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices
GB/T 11499-2001
Active
GB/T 11499-2001 Letter symbols for discrete semiconductor devices
GB/T 20521-2006
Active