T/SOECC 006-4-2022 Active Group standards

T/SOECC 006-4-2022 Ultra-fine copper and copper alloy round wire - Part 4: Ultra-fine silver-copper alloy round wire

Publish Date: 2022-12-27 Implement Date: 2022-12-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SOECC 006-4-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Copper and copper alloys

Publish Date: 2022-12-27

Implement Date: 2022-12-31

Scope

Main Technical Content: Ultrafine Copper and Copper Alloy Round Wires - Part 4: Ultrafine Copper-Silver Alloy Round Wires 1. Scope: Applies to the physical structure and electrical performance, specification methods, model specifications, inspection rules, and markings of ultrafine copper-silver alloy round wire conductors with a single-wire diameter of 0.008~0.100mm. This part is suitable for ultrafine copper-silver alloy round wires (hereinafter referred to as ultrafine wires) used in automotive, robotics, medical, consumer electronics, and aerospace/aviation cable applications. 2. Normative Reference Documents: The content of the following documents is an essential part of this document through normative reference. Among them, the referenced documents with a specified date only apply to the version corresponding to that date; the latest version (including all amendment sheets) of the unspecified date referenced documents applies to this document. - GB/T 8170: Rules for Rounding and Representing and Judging Extreme Values - T/SOECC 001.4-2021: High-Strength and High-Conductivity Copper Alloy Wires - Part 4: Copper-Silver Alloy Wires - T/SOECC 006.1-2022: Ultrafine Copper and Copper Alloy Round Wires - Part 1: General Requirements 3. Product Models and Specifications: The categories, grades, states, and specifications of ultrafine copper-silver alloy round wires shall comply with Table 1. Table 1: Grades, States, and Specifications of Ultrafine Copper-Silver Alloy Round Wires Grade Code Nominal Silver Content State Nominal Diameter (mm) CuAg1.0 CA100 1% ± 0.2 Soft (R) Hard (Y) 0.008≤d<0.100 CuAg2.0 CA200 2% ± 0.2 CuAg3.0 CA300 3% ± 0.2 CuAg4.0 CA400 4% ± 0.2 Technical Requirements 4.1 Material Requirements: The chemical composition of ultrafine copper-silver alloy round wires shall comply with T/SOECC 006.1-2022: Ultrafine Copper and Copper Alloy Round Wires - Part 1: General Requirements. The chemical composi