T/GD1AIA 006-2024 Active Group standards

T/GD1AIA 010-2024 Anti-settling silicone thermal potting adhesive

T/GD1AIA 010-2024 Anti-settling silicone thermal potting adhesive

Publish Date: 2024-12-04 Implement Date: 2024-12-05 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/GD1AIA 006-2024
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Adhesives and adhesive products
Publish Date: 2024-12-04
Implement Date: 2024-12-05

Scope

Main technical content: This document specifies the terms and definitions, classification, requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of anti-settling silicone thermal conductive encapsulation adhesives. This document is applicable to silicone encapsulation adhesives based on polysiloxane, which have both anti-settling and thermal conductivity capabilities.

Development Information

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