YS/T 1703-2024 Active Industry standards-Non-ferrous metals

YS/T 1703-2024 Test of surface particles on chip packaging trays for counting liquid particles in YS/T 1703-2024

Publish Date: 2024-10-24 Implement Date: 2025-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 1703-2024

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Analysis methods for semi-metallic and semiconductor materials

ICS Name: \nMetal material testing

Publish Date: 2024-10-24

Implement Date: 2025-05-01

Scope

This document is applicable to the cleanliness test of silicon polished wafers, silicon epitaxial wafers, SOI wafers, and semiconductor wafers of other materials with diameters of 100mm, 125mm, 150mm, 200mm, and 300mm in packaging boxes and granules