T/CEMIA 021-2019 Active Group standards

T/CEMIA 021-2019 Resistor paste specification for thick film integrated circuits

T/CEMIA 021-2019 Resistor paste specification for thick film integrated circuits

Publish Date: 2019-09-25 Implement Date: 2019-12-25 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/CEMIA 021-2019
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Electronic devices and specialized materials, parts, and structural components
ICS Name: Special materials for electronic technology
Publish Date: 2019-09-25
Implement Date: 2019-12-25
Pages: 12 pages

Scope

This standard specifies the definition, technical requirements, testing methods, inspection rules, and packaging, marking, transportation, and storage of resistive pastes for thick-film integrated circuits. This standard applies to resistive pastes for thick-film integrated circuits (hereinafter referred to as resistive pastes), which are composed of functional phases, glass phases, organic carriers, and additives and meet the printing requirements.

Development Information

Word Count: 15 Thousand words Pages: 12 pages

Referenced Standards

Related Standards

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