GB/T 7124-1986
Replaced
T/SHDSGY 051-2023
Active
Group standards
T/SHDSGY 051-2023 Low-temperature curing one-component conductive adhesive
T/SHDSGY 051-2023 Low-temperature curing one-component conductive adhesive
Price:
$ 20.00
Basic Information
Standard Code:
T/SHDSGY 051-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Adhesives and adhesive products
Publish Date:
2023-04-10
Implement Date:
2023-04-10
Scope
Main technical content: This standard specifies the terms and definitions, requirements, test methods, inspection rules, and marking, labeling, user manuals, packaging, transportation, and storage for low-temperature curing one-component low-stress insulating adhesives. This standard is applicable to low-temperature curing one-component low-stress insulating adhesives.
Development Information
Related Standards
GB/T 7749-1987
Active
GB/T 7749-1987 Test method of cleavage strength of adhesive (metal to metal)
GB/T 7750-1987
Active
GB/T 7750-1987 Test method of creep properties of adhesive in shear by tension loading (metal to metal)
GB/T 11177-1989
Active
GB/T 11177-1989 Testing method for compressive shear strength of dowel joint by inorganic adhesives
GB/T 12216-1990
Abolished
GB/T 12216-1990 The residue from distillation of synthetic fatty acids as binder for foundry
GB/T 13353-1992
Active