GB/T 2413-1981
Active
SJ/T 11391-2019
Active
Industry standards-Electronics
SJ/T 11391-2019 Solder alloy powder for electronic product welding
SJ/T 11391-2019 Solder alloy powder for electronic product welding
Basic Information
Standard Code:
SJ/T 11391-2019
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic devices and specialized materials, parts, and structural components
ICS Name:
Special materials for electronic technology
Publish Date:
2019-12-24
Implement Date:
2020-07-01
Scope
This standard specifies the technical requirements, test methods, inspection rules, and packaging, labeling, transportation, and storage for tin alloy powder used in the welding of electronic products.
Development Information
Replace the following standards
Related Standards
GB/T 3389.4-1982
Replaced
GB/T 3389.4-1982 Test methods for the properties of piezoelectric ceramics—Longitudinal length extension vibration mode for rod
GB/T 5594.1-1985
Active
GB/T 5594.1-1985 Test methods for properties of structure ceramic used in electronic components—Test method for gas-tightness
GB/T 5594.2-1985
Active
GB/T 5594.2-1985 Test methods for properties of structure ceramic used in electronic components—Test method for Youngs elastic modulus and Poisson ratio
GB/T 5594.3-1985
Replaced
GB/T 5594.3-1985 Test methods for properties of structure ceramic used in electronic components—Test method for mean coefficient of linear expansion
GB/T 5594.4-1985
Replaced