T/ZSA 304-2025 Electronic product printed circuit board design for manufacturability (DFM) and reliability design specification
T/ZSA 304-2025 Electronic product printed circuit board design for manufacturability (DFM) and reliability design specification
Basic Information
Scope
Scope: This document specifies the component selection, pad packaging design, wiring design, wire connection design, via design, test point design, solder mask and silkscreen design, component layout design, red glue process design, heat dissipation design, electromagnetic compatibility design, assembly reliability design, manufacturability design, reference mark design, panel assembly design, V-CUT design, etc. for printed circuit boards. This document is applicable to the design, manufacturing, and inspection and verification of printed circuit boards. Main technical content: This document specifies the component selection, pad packaging design, wiring design, wire connection design, via design, test point design, solder mask and silkscreen design, component layout design, red glue process design, heat dissipation design, electromagnetic compatibility design, assembly reliability design, manufacturability design, reference mark design, panel assembly design, V-CUT design, etc. for printed circuit boards. This document is applicable to the design, manufacturing, and inspection and verification of printed circuit boards.