YS/T 1595-2023 Active Industry standards-Non-ferrous metals

YS/T 1595-2023 Molybdenum-copper layered composite material for electronic packaging

Publish Date: 2023-04-21 Implement Date: 2023-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: YS/T 1595-2023

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Rare high-melting-point metals and their alloys

ICS Name: Other non-ferrous metal products

Publish Date: 2023-04-21

Implement Date: 2023-11-01

Scope

This document is applicable to molybdenum-copper layered composite boards for electronic packaging, which include three-layer composite boards and five-layer composite boards.