T/HNNMIA 54-2023 Gold-plated aluminum wire for packaging bonding
T/HNNMIA 54-2023 Gold-plated aluminum wire for packaging bonding
Basic Information
Scope
Main technical content: This document specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, and order form (or contract) content of gold-plated aluminum wires used for device packaging and bonding (hereinafter referred to as "wire"). (Quality specification) This document is applicable to gold-plated aluminum wires used for device packaging and bonding (hereinafter referred to as "wire"). Table 2: Chemical Composition and Grade Chemical Composition Au/% All measurable impurities total/% Al/% AUAL05≥0.03≤0.01 Balance AUAL10≥0.05≤0.01 Balance AUAL15≥0.08≤0.01 Balance Table 3: Diameter Tolerance Diameter/mm Tolerance/mm 0.050±0.0004~-0.001 0.075±0.0004~-0.001 0.100±0.0008~-0.002 0.150±0.0008~-0.002 0.200±0.0008~-0.002 0.250±0.0008~-0.002 0.300±0.0010~-0.0025 0.380±0.0010~-0.0025 0.400±0.0010~-0.0025