GB/T 4855-1984
Abolished
GB/T 15879.604-2023
Active
National standards
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4:General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array(BGA)
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4:General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array(BGA)
Basic Information
Standard Code:
GB/T 15879.604-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-05-23
Implement Date:
2023-09-01
Pages:
17 pages
Scope
This document specifies the measurement methods for the dimensions of ball grid array (BGA) packages.
The measurement methods specified in this document provide users with dimensional assurance under the following conditions:
a) Measurements are generally conducted manually or automatically;
b) If a particular dimension is not easily measured directly, the best alternative measurement method will be identified as the preferred method.
Development Information
Referenced Standards
IEC 60191-6:2009
Adopt standards
IEC 60191-6-4:2003
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished