GB/T 27581-2011 Active National standards

GB/T 27581-2011 Electromagnetic interference shielding film—Electroless copper plating solution—Method of determining concentration of Ni2+ and Cu2+

Publish Date: 2011-12-05 Implement Date: 2012-03-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 27581-2011

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Organic chemical raw materials

ICS Name: Other organic chemicals

Publish Date: 2011-12-05

Implement Date: 2012-03-01

Pages: 6 pages

Scope

This standard specifies the method for determining the content of nickel ions and copper ions in electromagnetic shielding film-used chemical copper plating solutions.
This standard is applicable to the testing of nickel ions and copper ions in electromagnetic shielding film-used chemical copper plating solutions. The measurement range is: the nickel ions concentration in the chemical copper plating solution, calculated as NiSO4·6H2O, is 0.20 g/L to 2.00 g/L; the copper ions concentration in the chemical copper plating solution, calculated as CuSO4·5H2O, is 5.0 g/L to 60.0 g/L.