DZ/T 0101.12-1994
Active
SJ 21405-2018
Active
Industry standards-Electronics
SJ 21405-2018 Metal packages for microelectronic packaging-Technical requirements for the plating process of aluminium-silicon alloy packages
SJ 21405-2018 Metal packages for microelectronic packaging-Technical requirements for the plating process of aluminium-silicon alloy packages
Price:
$ 30
Basic Information
Standard Code:
SJ 21405-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
11 pages
Scope
This standard specifies the general requirements for personnel, environment, safety, and environmental protection in the plating process of aluminum-silicon housings for microelectronic packaging, as well as detailed requirements for processes such as degreasing, pickling, zinc immersion, chemical nickel plating, heat treatment, gold plating, and inspection. This standard applies to the plating process of aluminum-silicon structural parts and aluminum-silicon housings for microelectronic packaging, which involves first chemical nickel plating and then electrolytic gold plating.
Development Information
Referenced Standards
GB/T 620-2011 Chemical reagent—Hydrofluoric acid
GB/T 622-2006 Chemical reagent—Hydrochloric acid
GB/T 626-2006 Chemical reagent—Nitric acid
GB/T 11446.1-2003
GB 21900
GJB 480
GJB 1941
GJB 2440A-2006
SJ 20129-1992 Methods for measurement of metallic coating thickness
SJ 20846-2002 Specification for gold [1] potassium cyanide for electroplating
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