T/CEPEA 0101-2023 Active Group standards

T/CEPEA 0101-2023 The X-ray real-time imaging detection method for IGBT module welding quality

Publish Date: 2024-03-01 Implement Date: 2024-03-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CEPEA 0101-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2024-03-01

Implement Date: 2024-03-15

Scope

Main technical content: X-ray real-time imaging technology is a non-destructive testing technology that uses X-ray receiving devices and monitors to replace the film in traditional radiography to obtain X-ray images. Using X-ray receiving devices, invisible X-rays are converted into digital or analog signals, and after image imaging and processing, they are displayed on the monitor. Based on the principle that X-rays exhibit different degrees of attenuation when penetrating different materials, the X-ray images show differences in brightness and darkness. The image processing system overcomes the differences in image brightness and darkness caused by different X-ray sources and X-ray detectors, as well as the differences in density and thickness of the welding layer materials, and the difficulty of poor layer segmentation. The image is segmented into two layers: the pad layer and the cavity layer. The image processing system calculates the ratio of the cavity area in the cavity layer to the pad area in the pad layer, that is, the cavity rate of the welding layer, to achieve the purpose of detecting the welding quality of the first welding layer and the second welding layer of the DBC substrate.