GB/T 4855-1984
Abolished
T/ZZB 2858-2022
Active
Group standards
T/ZZB 2858-2022 Integrated Circuits - Small Outline Package Lead Frame
T/ZZB 2858-2022 Micro-Small Outline Package (μ-SOP) lead frame
Price:
$ 20.00
Basic Information
Standard Code:
T/ZZB 2858-2022
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2022-12-08
Implement Date:
2022-12-31
Scope
Main technical content: This document specifies the terms, definitions, and abbreviations of integrated circuit small-outline package lead frames (hereinafter referred to as lead frames), basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and quality commitments. This document is applicable to stamped lead frames for integrated circuit small-outline packages, including SOP, TSSOP, SSOP, QSOP, MSOP, and other types.
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished