GB/T 43315-2023 Active National standards

GB/T 43315-2023 Test method for flow pattern defects in silicon wafer—Etching technique

GB/T 43315-2023 Test method for flow pattern defects in silicon wafer—Etching technique

Publish Date: 2023-11-27 Implement Date: 2024-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 43315-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: \nTest methods for the physical properties of metals
ICS Name: \nMetal material testing
Publish Date: 2023-11-27
Implement Date: 2024-06-01
Pages: 6 pages

Scope

This document specifies the method of detecting flow pattern defects on silicon wafers using a metallographic microscope after chemical etching.
This document is applicable to the detection of flow pattern defects on silicon wafers with a resistivity greater than 1 Ω·cm.

Development Information

Word Count: 13 Thousand words Pages: 6 pages

Referenced Standards

Related Standards

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