T/CSTM 00908-2022 Active Group standards

T/CSTM 00908-2022 Test method for solder resist ink for high-speed printed circuit board

Publish Date: 2022-12-27 Implement Date: 2023-03-27 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CSTM 00908-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components and information technology

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2022-12-27

Implement Date: 2023-03-27

Scope

Scope: This document specifies the performance test methods for solder mask inks used on high-speed printed circuit boards, including their appearance, dimensions, hardness, adhesion, resistance to reagents and solvents, simulation of lead-free reflow soldering, dielectric strength, wet-heat insulation resistance, thermal shock, dielectric constant and tangent of dielectric loss angle, characteristic impedance, and insertion loss. This document is applicable to solder mask inks used on high-speed printed circuit boards. Solder mask inks used on printed circuit boards in other industries can refer to this document for use. Main technical content: This document specifies the performance test methods for solder mask inks used on high-speed printed circuit boards, including their appearance, dimensions, hardness, adhesion, resistance to reagents and solvents, simulation of lead-free reflow soldering, dielectric strength, wet-heat insulation resistance, thermal shock, dielectric constant and tangent of dielectric loss angle, characteristic impedance, and insertion loss. This document is applicable to solder mask inks used on high-speed printed circuit boards. Solder mask inks used on printed circuit boards in other industries can refer to this document for use.