T/CPCA 6046-2022 Active Group standards

T/CPCA 6046-2022 Embed or insert copper block printed circuit board specification

Publish Date: 2022-06-23 Implement Date: 2022-08-23 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CPCA 6046-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2022-06-23

Implement Date: 2022-08-23

Scope

Main technical content: This document specifies the terms and definitions, technical requirements, inspection methods, quality assurance, packaging, marking, transportation, and storage for printed circuit boards with embedded or implanted copper blocks. It applies to printed circuit boards with embedded or implanted copper blocks and structures and/or common technologies made from them, providing identification and performance requirements. It also establishes acceptance and evaluation criteria for printed circuit boards with embedded or implanted copper blocks used in high-power or high-current power modules and traditional signal modules. Strictly speaking, there are three structures of printed circuit boards with embedded or implanted copper blocks, namely printed circuit boards with embedded copper blocks, printed circuit boards with implanted copper blocks, and printed circuit boards with both embedded and implanted copper blocks. Since printed circuit boards with both embedded and implanted copper blocks have their structures separately reflected in printed circuit boards with embedded copper blocks or printed circuit boards with implanted copper blocks, only two structures, printed circuit boards with copper blocks and printed circuit boards with implanted copper blocks, are listed in this standard. The integrity of the structure of such printed circuit boards includes requirements and specifications for residual adhesive width, cracks in the metal layer of plated holes, capillary absorption of plated holes, warping of connection pads, copper plating thickness of metallized holes, minimum spacing between hole walls and disconnected inner layer conductors, solder mask thickness, solder mask plugged holes, resin plugged holes, final plating (coating) thickness, conductor thickness, wire width, wire spacing, and insulation layer thickness between conductor layers. Electrical performance mainly sets out specific requirements and inspection methods for connectivi