T/CPCA 4105-2016 Metal-based copper-clad laminate for printed circuit board
T/CPCA 4105-2016 Metal-based copper-clad laminate for printed circuit board
Basic Information
Scope
Scope: This standard specifies the classification, materials, requirements, quality assurance, packaging, marking, transportation, and storage of metal-based copper-clad laminates for printed circuits. This standard applies to flame-retardant metal-based copper-clad laminates. Main technical contents: This standard replaces T/CPCA 4105-2010. Compared with T/CPCA 4105-2010, the main technical changes are as follows: - The thermal conductivity (insulation adhesive layer) grade is increased to Grade E, with a thermal conductivity of 3.0 W/(m?K) < λ ≤ 5.0 W/(m?K); - The "shear plate length and width and tolerances" are deleted, and the "length and width of the entire plate and tolerances" are changed from being agreed upon by both parties to specific requirements; - The "thickness and tolerances of metal-based copper-clad laminates" are increased by one level to "3.00mm < t ≤ 4.00mm"; - Specific requirements for the nominal thickness and tolerances of the insulation adhesive layer are added; - The breakdown voltage is reclassified according to the thickness of the insulation layer; - Requirements for withstand voltage testing are added.