T/CAEE 049-2026 Oxygen-free Copper Foil
T/CAEE 049-2026 Oxygen-free Copper Foil
Basic Information
Scope
This document specifies the classification, grades and states, dimensions and allowable deviations, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and accompanying documents, as well as ordering information for oxygen-free copper foil materials. This document applies to oxygen-free copper foil materials with a thickness of 0.005 mm to 0.150 mm and a width of no more than 1,300 mm, manufactured from high-purity cathode copper or oxygen-free copper ingots through rolling, annealing, and finishing processes. Electrical Performance For O60 to H02 states, the conductivity shall be not less than 100% IACS; for H04 to H08 states, it shall be not less than 98% IACS. Grain Size For soft-state (O60) oxygen-free copper foil materials, the grain size shall be 0.015 mm to 0.050 mm; for other states, the grain size shall be determined through negotiation between the supplier and the buyer. Surface Quality 5.6.1 Surface Roughness: For smooth foil materials, the surface roughness Ra shall be ≤0.3 μm; for low roughness, it shall be ≤0.15 μm; for ultra-low roughness, it shall be ≤0.05 μm; and for double-side roughened foil materials, the roughness shall be specified in the agreement. 5.6.2 Surface Defects: The foil surface shall not have defects such as pinholes, cracks, peeling, inclusions, oxidation spots, or color banding that are harmful to use. 5.6.3 Pinhole Detection shall be conducted in accordance with Appendix A, and the pinhole density shall not exceed 0.1 pieces/m2 (high precision) or 0.05 pieces/m2 (ultra-high precision). 5.6.4 Edge Quality: The edges shall be cut cleanly, without cracked edges, burrs, or serrated edges. The depth of edge cracks shall not exceed 5% of the foil thickness or 0.003 mm, whichever is greater. Process Performance 5.7.1 Peel Strength: According to IPC-TM-650 2.4.8, it shall be ≥1.2 N/mm (nominal thickness 0.035 mm, R2 surface). 5.7.2 Oxidation Resistance: After dryi