GB/T 43799-2024 Active National standards

GB/T 43799-2024 Sectional specification for high density interconnect printed boards

GB/T 43799-2024 Sectional specification for high density interconnect printed boards

Publish Date: 2024-03-15 Implement Date: 2024-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 43799-2024

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2024-03-15

Implement Date: 2024-07-01

Pages: 32 pages

Scope

This document specifies the application grades, performance requirements, quality assurance provisions, and delivery requirements for high-density interconnected printed circuit boards. This document is applicable to high-density interconnected printed circuit boards with micro-via holes.

Development Information

Word Count: 55 Thousand words Pages: 32 pages

Referenced Standards

GB/T 4588.4-2017 Sectional specification for rigid multilayer printed boards GB/T 4677-2002 Test methods of printed boards GB/T 16261-2017 General specification for printed circuit boards SJ 20828A-2018 SJ 21284-2018 GB/T 2036-1994 Terms for printed circuits GB/T 18334-2001 Specification for flexible multilayer printed boards with through connections GB/T 18335-2001 Specification for flex-rigid multilayer printed boards with through connections SJ/T 10668-2023 SJ/T 10668-2023 Electronic Assembly Technology Terminology SJ/T 11551-2015 Resin-coated copper foil for high-density interconnect printed circuit SJ/T 10668-1995 Terminology for surface mount technology SJ 21083-2016 Design requirements for high density interconnect printed circuit boards GB/T 18334-2025 Specification for flexible multilayer printed boards

Related Standards

GB/T 5489-1985 Replaced

GB/T 5489-1985 Printed board drawing

Publish Date: 1985-11-01

GB/T 12559-1990 Active

GB/T 12559-1990 The patternes series for artwork master of printed circuits

Publish Date: 1990-12-08

GB/T 12629-1990 Replaced

GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12630-1990 Active

GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12631-1990 Replaced

GB/T 12631-1990 Test method for resistance of conductor of printed boards

Publish Date: 1990-12-28

GB/T 13555-1992 Replaced

GB/T 13555-1992 Flexible copper-clad polyimide film for printed circuits

Publish Date: 1992-07-08