GB/T 35005-2018 Active National standards

GB/T 35005-2018 Test methods for flip chip integrated circuits

Publish Date: 2018-03-15 Implement Date: 2018-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 35005-2018

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Microcircuit

ICS Name: Integrated circuits, microelectronics

Publish Date: 2018-03-15

Implement Date: 2018-08-01

Pages: 18 pages

Scope

This standard specifies the physical testing methods related to bump coplanarity, bump shear force, chip shear pullout force, solder joint defects, and underfill defects in the flip-chip integrated circuit packaging process. This standard is applicable to flip-chip single-chip integrated circuits packaged in ceramic or plastic packages.

Development Information

Word Count: 34 Thousand words Pages: 18 pages

Referenced Standards

GJB 548B-2009

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