SJ 21449-2018 Active Industry standards-Electronics

SJ 21449-2018 Interated circuit ceramic package-Inspection requirements for predie-attachment

SJ 21449-2018 Interated circuit ceramic package-Inspection requirements for predie-attachment

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: SJ 21449-2018
Standard Type: Industry standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: -
Publish Date: 2018-01-18
Implement Date: 2018-05-01
Pages: 10 pages

Scope

This standard specifies the general and detailed requirements for the pre-inspection of integrated circuit ceramic packages. This standard is applicable to the inspection of chips, shells, and package materials before the integrated circuit ceramic packaging process

Development Information

Pages: 10 pages

Referenced Standards

Related Standards

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