SJ 21287-2018 Active Industry standards-Electronics

SJ 21287-2018 Specification for resin coated copper foil of HDI printed circuit board

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 30

Basic Information

Standard Code: SJ 21287-2018

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 2018-01-18

Implement Date: 2018-05-01

Pages: 18 pages

Scope

This specification stipulates the performance requirements, quality assurance provisions, delivery preparation, and explanatory matters for resin-coated copper foil used in high-density interconnected printed circuits (hereinafter referred to as resin-coated copper foil). This specification applies to the production, inspection, and acceptance of resin-coated copper foil products used in high-density interconnected printed circuits.

Development Information

Pages: 18 pages

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