SJ/T 11273-2016 Active Industry standards-Electronics

SJ/T 11273-2016 Cleaning-free liquid solder paste

Publish Date: 2016-04-05 Implement Date: 2016-09-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: SJ/T 11273-2016

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2016-04-05

Implement Date: 2016-09-01

Pages: 19 pages

Development Information

Pages: 19 pages

Replace the following standards

SJ/T 11273-2002 Cleaning-free liquid soldering flux

Related Standards

GB/T 5489-1985 Replaced

GB/T 5489-1985 Printed board drawing

Publish Date: 1985-11-01

GB/T 12559-1990 Active

GB/T 12559-1990 The patternes series for artwork master of printed circuits

Publish Date: 1990-12-08

GB/T 12629-1990 Replaced

GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12630-1990 Active

GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12631-1990 Replaced

GB/T 12631-1990 Test method for resistance of conductor of printed boards

Publish Date: 1990-12-28

GB/T 13555-1992 Replaced

GB/T 13555-1992 Flexible copper-clad polyimide film for printed circuits

Publish Date: 1992-07-08