T/BIE 003-2023 Active Group standards

T/BIE 003-2023 Through-hole reflow soldering technology specification

Publish Date: 2023-03-14 Implement Date: 2023-03-14 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/BIE 003-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Electronic components comprehensive

Publish Date: 2023-03-14

Implement Date: 2023-03-14

Scope

Scope: This document specifies the general requirements for high-quality welding interconnection and assembly of printed circuit boards using common reflow soldering technology, and describes the relevant specifications for components, printed circuit boards, and stencil design, as well as the test conditions and methods for related tests of components and assemblies. This document stipulates the basic matters, process conditions, and inspection criteria for through-hole reflow soldering of printed circuit boards, as well as general norms for relevant test conditions. Main technical content: General requirements for through-hole reflow soldering; Outline and design of components for through-hole reflow soldering; Design of printed circuit boards for through-hole reflow soldering; Process specifications for through-hole reflow soldering; Acceptable judgment criteria for electronic assemblies for through-hole reflow soldering; Typical defect examples of through-hole reflow soldering; Guidelines for stencil design; Tolerance of terminal positions and hole matching, as well as related test and specification requirements for through-hole reflow soldering components.