T/CPCA 4107-2018 High-reflective copper clad laminate for printed circuit board
T/CPCA 4107-2018 High-reflective copper clad laminate for printed circuit board
Basic Information
Scope
Main Technical Content: 4.1 Name: High-Reflective Copper-Clad Laminated Sheets for Printed Circuits 4.2 Scope: Specifies the product model, structure, and materials, requirements, test methods, quality assurance, packaging, marking, transportation, and storage of high-reflective copper-clad laminates for printed circuits. Applicable to printed circuit boards for high-brightness LEDs and packaging printed circuit boards. 4.3 High-Reflective Copper-Clad Laminated Sheets: Defined as having a reflectivity of ≥80% in the receiving state. 4.4 Product Structure: High-reflective copper-clad laminates are composed of an insulating adhesive layer (made of resin systems and reinforcing materials) and single- or double-sided copper foil. 4.5 Performance Requirements: 4.5.1 Appearance requirements 4.5.2 Dimensional requirements including: length, width, thickness, thickness tolerance, warping, twisting, and verticality 4.5.3 Chemical performance requirements including: flammability, thermal stress, glass transition temperature, thermal layering time, Z-axis thermal expansion coefficient, and solderability 4.5.4 Physical performance requirements including: peel strength, reflectivity, whiteness, breakdown voltage, voltage resistance, volume resistivity, surface resistivity, and bending modulus 4.5.5 Environmental requirements including: halogen content and water absorption 4.5.6 Test methods including: reflectivity and whiteness (see Normative Appendix A); other test methods refer to GB/T 4722-2017 4.5.7 Quality assurance requirements 4.5.8 Packaging, transportation, and storage requirements