GB/T 28859-2012 Replaced National standards

GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components

Publish Date: 2012-11-05 Implement Date: 2013-02-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 28859-2012

Standard Type: National standards

Standard Status: Replaced

is_force_gb: no

CCS Name: Electronic devices and specialized materials, parts, and structural components

ICS Name: Special materials for electronic technology

Publish Date: 2012-11-05

Implement Date: 2013-02-15

Pages: 16 pages

Scope

This standard specifies the classification, technical requirements, inspection rules, inspection methods, packaging, marking, transportation, and storage requirements for epoxy powder encapsulants used in electronic components (hereinafter referred to as encapsulants).
This standard applies to epoxy powder encapsulants used in fluidized bed encapsulation of electronic components such as ceramic capacitors, pressure-sensitive resistors, film capacitors, resistance networks, and thermistors.

Development Information

Word Count: 21 Thousand words Pages: 16 pages

Superseded by the following standards

GB/T 28859-2025 Epoxy powder encapsulation material for electronic packaging

Referenced Standards

GB/T 1034-2008 Plastics—Determination of water absorption GB/T 1408.1-2006 Electrical strength of insulating materials—Test methods—Part 1:Tests at power frequencies GB/T 1409-2006 Recommended methods for the determination of the permittivity and dielectric dissipation fator of electrical insulating materials at power,audio and radio frequencies including meter wavelengths GB/T 1636-2008 Plastics—Determination of apparent density material that can be poured from a specified funnel GB/T 2411-2008 Plastics and ebonite—Determination of indentation hardness by means of a durometer(shore hardness) GB/T 5169.16-2008 Fire hazard testing for electric and electronic products—Part 16:Test flames—50 W horizontal and vertical flame test methods GB/T 6003.1-1997 Test sieves of metal wire cloth GB/T 10064-2006 Methods of test for the determination of the insulation resistance of solid insulating materials GB/T 21782.1-2008 Coating powders—Part 1:Determination of particle size distribution by sieving GB/T 28858-2012 Encapsulating material of phenolic for electronic components GB/T 28860-2012 Test method for the determination of get time of encapsulating material of powdered epoxy GB/T 28861-2012 Test method for measuring melt fluidity of encapsulating material of powdered epoxy GB/T 28862-2012 Method for processing sample of encapsulating material of powdered epoxy IPC-TM-650 GB/T 4722-1992 Test methods for copper-clad laminated sheets for printed circuits GB/T 4722-2017 Test methods for rigid copper clad laminates for printed circuits board

Related Standards

GB/T 2413-1981 Active

GB/T 2413-1981 Piezoelectric ceramic materials—Measuring methods for determination of volume density

Publish Date: 1980-12-31

GB/T 3389.4-1982 Replaced

GB/T 3389.4-1982 Test methods for the properties of piezoelectric ceramics—Longitudinal length extension vibration mode for rod

Publish Date: 1982-12-30

GB/T 5594.1-1985 Active

GB/T 5594.1-1985 Test methods for properties of structure ceramic used in electronic components—Test method for gas-tightness

Publish Date: 1985-11-27

GB/T 5594.2-1985 Active

GB/T 5594.2-1985 Test methods for properties of structure ceramic used in electronic components—Test method for Youngs elastic modulus and Poisson ratio

Publish Date: 1985-11-27

GB/T 5594.3-1985 Replaced

GB/T 5594.3-1985 Test methods for properties of structure ceramic used in electronic components—Test method for mean coefficient of linear expansion

Publish Date: 1985-11-27

GB/T 5594.4-1985 Replaced

GB/T 5594.4-1985 Test methods for properties of structure ceramic used in electronic components—Test method for dielectric loss angle tangent value

Publish Date: 1985-11-27