GB/T 28859-2025 Active National standards

GB/T 28859-2025 Epoxy powder encapsulation material for electronic packaging

Publish Date: 2025-08-01 Implement Date: 2026-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 28859-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic devices and specialized materials, parts, and structural components

ICS Name: Special materials for electronic technology

Publish Date: 2025-08-01

Implement Date: 2026-02-01

Pages: 20 pages

Scope

This document specifies the product classification, requirements, inspection rules, and packaging, marking, storage, and transportation requirements for epoxy powder encapsulants used in electronic packaging (hereinafter referred to as "encapsulants"), and describes the corresponding test methods.
This document is applicable to epoxy powder encapsulants used in electronic components such as ceramic capacitors, pressure-sensitive resistors, film capacitors, resistance networks, and thermal resistors, as well as fluidized beds for encapsulation.

Development Information

Word Count: 27 Thousand words Pages: 20 pages

Replace the following standards

GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components GB/T 28861-2012 Test method for measuring melt fluidity of encapsulating material of powdered epoxy

Referenced Standards

GB/T 1034-2008 Plastics—Determination of water absorption GB/T 1408.1-1999 Methods of test for electric strength of solid insulating materials-Tests at power frequencies GB/T 1408.1-2006 Electrical strength of insulating materials—Test methods—Part 1:Tests at power frequencies GB/T 1408.1-2016 Insulating materials—Test methods for electric strength—Part 1:Test at power frequencies GB/T 1409-2006 Recommended methods for the determination of the permittivity and dielectric dissipation fator of electrical insulating materials at power,audio and radio frequencies including meter wavelengths GB/T 1636-2008 Plastics—Determination of apparent density material that can be poured from a specified funnel GB/T 2411-1980 Plastics—Shore hardness test GB/T 2411-2008 Plastics and ebonite—Determination of indentation hardness by means of a durometer(shore hardness) GB/T 3139-1982 Test method for thermal conductivity of glassfiber reinforced plastics GB/T 3139-2005 Fiber-reinforced plastics composites—Determination of thermal conductivity GB/T 4207-2022 Method for the determination of the proof and the comparative tracking indices of solid insulating materials GB/T 4722-2017 Test methods for rigid copper clad laminates for printed circuits board GB/T 5169.16-2017 Fire hazard testing for electric and electronic products—Part 16:Test flames—50 W horizontal and vertical flame test methods GB/T 6003.1-1997 Test sieves of metal wire cloth GB/T 6003.1-2012 Test sieves—Technical requirements and testing—Part 1:Test sieves of metal wire cloth GB/T 6003.1-2022 Test sieves—Technical requirements and testing—Part 1:Test sieves of metal wire cloth GB/T 9341-2000 Plastics—Determination of flexural properties GB/T 9341-2008 Plastics—Determination of flexural properties GB/T 21782.9-2010 Coating powders—Part 9:Sampling GB/T 26572-2011 Requirements of concentration limits for certain restricted substances in electrical and electronic products GB 26572-2025 Requirements for restricted use of hazardous substances in electrical and electronic products GB/T 28858-2012 Encapsulating material of phenolic for electronic components GB/T 28860-2012 Test method for the determination of get time of encapsulating material of powdered epoxy GB/T 28862-2012 Method for processing sample of encapsulating material of powdered epoxy GB/T 31838.2-2019 Solid insulating materials—Dielectric and resistive properties—Part 2:Resistive properties(DC methods)—Volume resistance and volume resistivity GB/T 31838.4-2019 Solid insulating materials—Dielectric and resistive properties—Part 4:Resistive properties(DC methods)—Insulation resistance GB/T 36800.2-2018 Plastics—Thermomechanical analysis(TMA)—Part 2:Determination of coefficient of linear thermal expansion and glass transition temperature GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging

Related Standards

GB/T 2413-1981 Active

GB/T 2413-1981 Piezoelectric ceramic materials—Measuring methods for determination of volume density

Publish Date: 1980-12-31

GB/T 3389.4-1982 Replaced

GB/T 3389.4-1982 Test methods for the properties of piezoelectric ceramics—Longitudinal length extension vibration mode for rod

Publish Date: 1982-12-30

GB/T 5594.1-1985 Active

GB/T 5594.1-1985 Test methods for properties of structure ceramic used in electronic components—Test method for gas-tightness

Publish Date: 1985-11-27

GB/T 5594.2-1985 Active

GB/T 5594.2-1985 Test methods for properties of structure ceramic used in electronic components—Test method for Youngs elastic modulus and Poisson ratio

Publish Date: 1985-11-27

GB/T 5594.3-1985 Replaced

GB/T 5594.3-1985 Test methods for properties of structure ceramic used in electronic components—Test method for mean coefficient of linear expansion

Publish Date: 1985-11-27

GB/T 5594.4-1985 Replaced

GB/T 5594.4-1985 Test methods for properties of structure ceramic used in electronic components—Test method for dielectric loss angle tangent value

Publish Date: 1985-11-27