T/DZJN 17-2020 Green Micro Data Center Technical Specification
T/DZJN 17-2020 Green Micro Data Center Technical Specification
Basic Information
Scope
Main Technical Content: 7.1 General Requirements 7.1.1 Overall Design Requirements a) The green micro data center should have the characteristics of strong adaptability to the basic environment, space-saving, easy management, maintenance, and scalability. b) The green micro data center should include systems such as cabinets, power supply and distribution systems, uninterruptible power supplies, lighting in cabinets, precision air conditioning, integrated wiring, and environmental and equipment monitoring. c) The green micro data center should be designed, integrated, and delivered as an independent product. All subsystems should be pre-installed and pre-tested in the factory, and the overall green micro data center can be installed and delivered on-site through simple assembly, thus shortening the project construction cycle and reducing construction difficulty. d) The green micro data center should operate in an indoor environment, with air conditioning airflow organization forming a closed cold channel in the front of the cabinet and a closed hot channel in the back. e) If the cooling system is external, the cabinet air intake mode should be front intake and rear exhaust, and corresponding wind guide components should be provided to accommodate the special air intake and exhaust methods of some electronic information equipment. f) The single cabinet load capacity of the green micro data center can be divided into three levels: 3KW, 5KW, and 7KW. g) The number of IT cabinets in the green micro data center should be between 1 and 10. 7.1.2 Cabinet Design Requirements a) The overall protection grade of the green micro data center cabinet should be no less than IP20. b) The static load of the green micro data center cabinet should be no less than 1500kN/m2, and the dynamic load should be no less than 600kN/m2. c) The green micro data center cabinet should meet the requirements of top and bottom wiring methods. At the wiring entrance, effectiv