T/CHBAS 17-2022 Active Group standards

T/CHBAS 17-2022 Target material for ultra-high purity tungsten plate

Publish Date: 2022-02-21 Implement Date: 2022-02-21 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CHBAS 17-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Non-ferrous metals and their alloy products

ICS Name: Non-ferrous metals comprehensive

Publish Date: 2022-02-21

Implement Date: 2022-02-21

Scope

Scope: This document specifies the requirements, test methods, inspection rules, marking, packaging, transportation, and storage for ultra-high purity tungsten plates used for target materials. This document applies to the manufacture, inspection (testing), and acceptance of ultra-high purity tungsten plates used for target materials. Main technical contents: - The chemical composition of ultra-high purity tungsten plates used for target materials must comply with the requirements of the technical drawings signed by both the supplier and the purchaser. For products without specified tolerances, they shall meet the requirements of the f (precision) deviations in Table 1, Table 2, and Table 3 of GB/T 1804-2000 Chapter 5. - The grain size of ultra-high purity tungsten plates used for target materials shall comply with the requirements of Table 2, and the grain size distribution shall be uniform. - There shall be no defects such as delamination, cracking, or pores in the interior of ultra-high purity tungsten plates used for target materials. - The density of ultra-high purity tungsten plates used for target materials shall be greater than 19.15 g/cm3, and the density variation within the same batch shall not exceed 0.3 g/cm3. - The surface of ultra-high purity tungsten plates used for target materials shall not have defects such as over-melting, bubbling, delamination, cracks, or inclusions. - The surface roughness Ra of ultra-high purity tungsten plates used for target materials shall not exceed 1.6 μm. For special requirements, the specifications shall be determined through consultation between the supplier and the purchaser.