T/XAI 15-2023 Active Group standards

T/XAI 15-2023 Stencil film base solder mask pattern design specification

Publish Date: 2023-08-01 Implement Date: 2023-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 20.00

Out of stock

Basic Information

Standard Code: T/XAI 15-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components

ICS Name: Terminology (principles and coordination and cooperation)

Publish Date: 2023-08-01

Implement Date: 2023-08-01

Scope

Scope: This document specifies the design principles and requirements for solder mask patterns on flip-chip film substrates, and provides verification methods. This document is applicable to the design of solder mask printing patterns on flip-chip film substrates. Main technical content: 1. Scope 2. Normative reference documents 3. Terms and definitions 4. Design principles 5. Design requirements 6. Verification methods