GB/T 4855-1984
Abolished
GB/T 15879.5-2018
Active
National standards
GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits
GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits
Basic Information
Standard Code:
GB/T 15879.5-2018
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2018-09-17
Implement Date:
2019-04-01
Pages:
36 pages
Scope
This part of the "Mechanical Standardization of Semiconductor Devices" specifies the recommended values for the packaging of integrated circuits using tape automated bonding (TAB) as the main components of the structure and interconnections. This part is applicable to finished units supplied by manufacturers to users, and there are no explicit requirements for the interconnection (internal lead welding) from the integrated circuit (IC) to the tape.
Development Information
Replace the following standards
Adopt standards
IEC 60191-5:1997
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished