GB/T 46788-2025 Active National standards

GB/T 46788-2025 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

Publish Date: 2025-12-02 Implement Date: 2026-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 46788-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor discrete devices

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2025-12-02

Implement Date: 2026-07-01

Pages: 40 pages

Scope

This document specifies the environmental acceptance tests for tin-based plating on the surface of semiconductor devices and methods to retard the growth of tin whiskers. This method may not meet the requirements of specific applications (such as military and aerospace), and supplementary requirements may be specified in appropriate specifications or procurement documents.
This document is not applicable to semiconductor devices with only bottom lead-out terminals (such as square flat leadless and ball grid array devices, flip-chip bump lead-out terminals), as all the plated surfaces of the lead-out terminals of such devices will be immersed during the assembly process.
When using this document, the reporting requirements in Chapter 7 must also be met.