T/CPCA 4308-2014 Copper sulfate used for plating manufacturing
T/CPCA 4308-2014 Copper sulfate used for plating manufacturing
Basic Information
Scope
This standard specifies the requirements for copper sulfate (i.e., copper sulfate pentahydrate [II]) used in the electroplating of printed circuit boards, including test methods, inspection rules, marking, labeling, packaging, transportation, and storage. This standard applies to copper sulfate used in the electroplating of printed circuit boards. This product is mainly used for copper electroplating and chemical copper plating. 1. Resolve the differences in the content and impurities of first-grade and high-purity copper sulfate used in the electroplating of printed circuit boards. 2. Solve the analysis errors and reproducibility issues of the copper sulfate content detection using volumetric analysis (arbitration method) and automatic potentiometric titration (rapid method). (Error analysis of experimental results is required.)