T/QGCML 1663-2023 Active Group standards

T/QGCML 1663-2023 General Technical Conditions for Hot Melt Adhesives

T/QGCML 1663-2023

Publish Date: 2023-10-11 Implement Date: 2023-10-26 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/QGCML 1663-2023
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Adhesives and adhesive products
Publish Date: 2023-10-11
Implement Date: 2023-10-26

Scope

Main technical content: This document specifies the terms and definitions, symbols, technical requirements, test methods, inspection rules, marking, packaging, storage, transportation, and usage instructions for hot melt adhesives. This document is applicable to hot melt adhesives used in applications such as wireless binding, household appliance packaging, and pipeline corrosion prevention.

Development Information

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