GB/T 6576-2002
Active
T/CASME 1853-2024
Active
Group standards
T/CASME 1853-2024 Semiconductor Wafer Processing Laser Cutting Machine
T/CASME 1853-2024 Semiconductor Wafer Processing Laser Cutting Machine
Price:
$ 20.00
Basic Information
Standard Code:
T/CASME 1853-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Mechanical
ICS Name:
Other machine tool devices
Publish Date:
2024-12-25
Implement Date:
2024-12-31
Scope
Scope: This document is applicable to the design and manufacture of laser cutting machines for semiconductor wafer processing; Main technical content: This document specifies the equipment configuration, model naming and main parameters, requirements, test methods, inspection rules and marking, packaging, transportation, and storage of laser cutting machines for semiconductor wafer processing.
Development Information
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