T/XAI 13-2023 Active Group standards

T/XAI 13-2023 Test Method for the Peel Strength of Linear Circuits on Chip-On-Film Substrates

T/XAI 13-2023

Publish Date: 2023-08-01 Implement Date: 2023-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/XAI 13-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components

ICS Name: The measurement of force, gravity, and pressure.

Publish Date: 2023-08-01

Implement Date: 2023-08-01

Scope

Scope: This document specifies the requirements for the peel strength test of the circuit on the flip-chip film substrate, including the principles, equipment, samples, conditions, methods, result evaluation, and reporting. It describes the peel strength test process and provides requirements for the test results. This document is applicable to the peel strength test of the circuit on the flip-chip film substrate. Main technical content: 1. Scope; 2. Normative references; 3. Terms and definitions; 4. Test principles; 5. Test equipment; 6. Sample preparation; 7. Test methods; 8. Test reports