T/SHDSGY 218-2022 Active Group standards

T/SHDSGY 218-2022 System-Level Packaging (SIP) Design Technical Specifications

T/SHDSGY 218-2022 System-in-Package (SIP) design technology specification

Publish Date: 2022-12-27 Implement Date: 2022-12-27 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SHDSGY 218-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Electronic components comprehensive

Publish Date: 2022-12-27

Implement Date: 2022-12-27

Scope

Main technical content: This document specifies the terms and definitions, development design requirements, design preparation, design process, and deliverables of the system-level packaging (SIP) design technology specification. This document is applicable to SIP design projects that implement the functions of the entire machine system through packaging.