T/JSQA 140-2022 Active Group standards

T/JSQA 140-2022 High-density interconnect multilayer printed circuit board

T/JSQA 140-2022 High-density interconnect multilayer printed circuit board

Publish Date: 2022-05-26 Implement Date: 2022-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/JSQA 140-2022
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Electronic components and information technology
ICS Name: Printed circuits and printed circuit boards
Publish Date: 2022-05-26
Implement Date: 2022-06-01

Scope

Scope: This document specifies the terms and definitions, product classification, requirements, test methods, inspection rules, marking, packaging, transportation, and storage of high-density interconnected multilayer printed circuit boards, hereinafter referred to as PCBs. This document is applicable to high-density interconnected multilayer printed circuit boards, hereinafter referred to as PCBs. Main technical content: This group standard specifies the terms and definitions, product classification, requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of high-density interconnected multilayer printed circuit boards. The technical requirements specify dimensional tolerances, appearance quality, electrical performance, physical performance, mechanical performance, and environmental performance. The dimensional tolerances and appearance quality are determined according to the actual situation of the company. The electrical performance, physical performance, mechanical performance, and environmental performance are determined in accordance with the relevant requirements of the industry standard IPC-6012E-2020 "Identification and Performance Specifications for Rigid Printed Boards".

Development Information

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