GB/T 4855-1984
Abolished
T/CASME 479-2023
Active
Group standards
T/CASME 479-2023 Semiconductor integrated circuits with plastic small outline package (SOIC) stamped lead frame
T/CASME 479-2023 Semiconductor integrated circuits with plastic small outline package (SOIC) stamped lead frame
Price:
$ 20.00
Basic Information
Standard Code:
T/CASME 479-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components and information technology
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-06-29
Implement Date:
2023-07-01
Scope
Scope: This document is applicable to the stamping type lead frames for plastic small-outline packages of semiconductor integrated circuits; Main technical content: This document specifies the terms and definitions, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of stamping type lead frames for plastic small-outline packages of semiconductor integrated circuits.
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished