SJ/T 11707-2018 Active Industry standards-Electronics

SJ/T 11707-2018 SJ/T 11707-2018 Thin-film interconnect technology - Geometric measurement terminology for through-silicon vias

SJ/T 11707-2018 SJ/T 11707-2018 Thin-film interconnect technology - Geometric measurement terminology for through-silicon vias

Publish Date: 2018-02-09 Implement Date: 2018-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: SJ/T 11707-2018
Standard Type: Industry standards
Standard Status: Active
is_force_gb: no
CCS Name: Basic standards and general methods
ICS Name: Electronic components comprehensive
Publish Date: 2018-02-09
Implement Date: 2018-04-01
Pages: 12 pages

Development Information

Pages: 12 pages

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