T/SOECC 005-11-2022 Painted copper-clad aluminum round wire for direct-weld self-adhesive type 155, polyurethane-painted copper-clad aluminum round wire

Scope

Main Technical Content: Copper-Clad Aluminum Round Wire for Winding, Part 11: Self-Adhesive Direct Welding Polyurethane-Coated Copper-Clad Aluminum Round Wire, Grade 15. **Scope**: This part specifies the requirements for self-adhesive direct welding copper-clad aluminum round wire with a double coating. The inner coating is based on polyurethane resin. If the chemical properties of the original resin can be preserved and all the requirements of this wire are met, the resin can be modified. The outer coating is a self-adhesive layer based on thermoplastic resin. **Note**: A modified resin is one that has undergone chemical changes or contains one or more additives to improve its performance or usage characteristics. **Grade 155**: Indicates a thermal grade, requiring a minimum temperature index of 155 and a thermal shock temperature of at least 175°C. The Celsius temperature corresponding to the temperature index is not the recommended operating temperature of the wire, as this depends on many factors including the type of equipment used. **Conductor Nominal Diameter Range**: - **Grade 1B**: 0.071 mm and above, 0.800 mm and below; - **Grade 2B**: 0.071 mm and above, 0.800 mm and below. The conductor nominal diameter is specified in accordance with Clause 4.2 of Part 1. **Normative Reference Documents**: The provisions of the following documents are incorporated into this part by reference from T/SOECC. - Date-specified references: All subsequent amendments (excluding corrections) or revised versions are not applicable to this part. However, parties agreeing to this part are encouraged to investigate whether the latest versions of these documents can be used. - Undated references: The latest versions apply to this part. **T/SOECC 005.1-2022**: Copper-Clad Aluminum Round Wire for Winding, Part 1: General Provisions **Definitions, Test Methods General Principles, and Appearance**: 3.1 Definitions, Test Methods General Principles: See C

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