GB/T 19247.6-2024 Active National standards

GB/T 19247.6-2024 Printed board assemblies—Part 6:Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Publish Date: 2024-03-15 Implement Date: 2024-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 19247.6-2024

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2024-03-15

Implement Date: 2024-07-01

Pages: 36 pages

Scope

This document specifies the requirements for the evaluation of solder joint voids in printed circuit board assemblies during their thermal cycling lifetime, and describes the method of using X-ray observation to determine voids. This document is applicable to the evaluation and testing of voids in solder joints of ball grid array (BGA) and land grid array (LGA) devices soldered on printed circuit boards, but not to the evaluation and testing of voids in the packages of BGA devices before assembly. This document is also applicable to the evaluation and testing of voids in solder joints formed by melting and re-solidification, such as flip-chip and multi-chip assemblies, except for BGA devices and LGA devices. It is not applicable to the evaluation and testing of voids in solder joints between BGA devices and printed circuit boards that have underfill material, or in solder joints within device packages. This document is applicable to large voids in solder joints ranging from 10 μm to several hundred micrometers, but not to smaller voids with diameters less than 10 μm (such as planar micro-voids).