HB/Z 5069-2011 Process and quality inspection for electroplated copper coatings

GB/T 620-1993 Chemical reagent—Hydrofluoric acid GB/T 620-2011 Chemical reagent—Hydrofluoric acid GB/T 625-1989 Chemical reagent—Sulfuric acid GB/T 625-2007 Chemical reagent—Sulfuric acid GB/T 625-2024 Chemical reagent—Sulfuric acid GB/T 6275-1986 Ammonium hydrogen carbonate for industrial use GB/T 629-1997 Chemical reagent—Sodium hydroxide GB/T 629-2026 Chemical reagent—Sodium hydroxide GB/T 644-1993 Chemical reagent—Potassium hexacyanoferrate (Ⅲ) GB/T 644-2011 Chemical reagent—Potassium hexacyanoferrate(Ⅲ) GB/T 6462-1986 Metallic and oxide coatings—Measurement of coating thickness—Microscopical method GB/T 6462-2005 Metallic and oxide coatings—Measurement of coating thickness—Microscopical method GB/T 6462-2025 Metallic and oxide coatings—Measurement of coating thinckness—Microscopical method GB/T 665-1988 Chemical reagent Copper(Ⅱ) sulfate pentahydrate GB/T 665-2007 Chemical reagent—Copper(Ⅱ)sulfate pentahydrate GB/T 9855-1988 Chemical reagent—Citric acid monohydrate GB/T 9855-2008 Chemical reagent—Citric acid monohydrate GJB 480A-1995 HB 5034 HB 5067.1 HB 5226 HB 5472-1991 The water quality specifications for metal plating and chemical coating processes HB/Z 5071-2004 Process and quality inspection for electroless nickel plating HB/Z 5082 HB/Z 5086.1 HB/Z 5086.2 HB/Z 5086.3 HB/Z 5086.4 HB/Z 5086.5 HB/Z 5086.6 HB/Z 5087.1-2004 Methods for analysis of acid plating copper solutions part 1:Determination of copper sulfate content by EDTA volumetric method HB/Z 5087.2-2004 Methods for analysis of acid plating copper solutions part 2:Determination of copper sulfate content by potentiometric titrimetric method HB/Z 5087.3-2004 Methods for analysis of acid plating copper solutions part 3:Determination of sulphuric acid content by potentiometric titrimetric method HB/Z 5087.4-2004 Methods for analysis of acid plating copper solutions part 4:Determination of iron content by atomic absorption spectrometric method HB/Z 5090.1 HB/Z 5109.10 HB/Z 5109.11 HB/Z 5109.12 HB/Z 5109.9 HB/Z 5110 HG/T 2517-2009 HG/T 2517-2009 Industrial Trisodium Phosphate HG/T 2517-1993 Industrial Trisodium Phosphate HG/T 2517-2025 Industrial Trisodium Phosphate HG/T 2827-2011 Copper(I) cyanide in industry HG/T 2827-1997 Copper(I) cyanide in industry HG/T 3591-2023 Industrial Potassium Pyrophosphate HG/T 3591-2009 Potassium Pyrophosphate for Electroplating HG/T 3591-1999 Potassium pyrophosphate used in electroplating HG/T 3593-2009 Copper pyrophosphate used in electroplating, as per HG/T 3593-2009 HG/T 3593-1999 Copper Pyrophosphate for Electroplating (HG/T 3593-1999) HG/T 3594-2010 Industrial pyrophosphoric acid HG/T 3594-1999 Electroplating with pyrophosphoric acid