GB/T 5489-1985
Replaced
DB34/T 3369-2019
Active
Anhui ProvinceLocal standards
DB34/T 3369-2019 Printed circuit board laminate substrate thickness determination method: metallographic method
DB34/T 3369-2019 Printed circuit board laminate substrate thickness determination method: metallographic method
Price:
$ 30
Basic Information
Standard Code:
DB34/T 3369-2019
Standard Type:
Local standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Printed circuit board
ICS Name:
Printed circuits and printed circuit boards
Publish Date:
2019-07-01
Implement Date:
2019-09-01
Pages:
6 pages
Scope
This standard specifies the instrumentation, testing procedures, and reporting for the metallographic method of determining the thickness of copper-clad laminates used in printed circuits. This standard is applicable to the metallographic determination of the thickness of copper-clad laminates used in printed circuits, with a measurement range of more than 30 μm.
Development Information
Related Standards
GB/T 12559-1990
Active
GB/T 12559-1990 The patternes series for artwork master of printed circuits
GB/T 12629-1990
Replaced
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 12630-1990
Active
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards
GB/T 12631-1990
Replaced
GB/T 12631-1990 Test method for resistance of conductor of printed boards
GB/T 13555-1992
Replaced